商品详情

2D锡膏测厚机

Laser Vision Measurement 品管量测设备

产品特性（FEATURES）

◆使用Window’s视窗介面，中/英文化书面，操作简单。

◆手动量测锡膏厚度

◆手动测量长、宽及两锡膏间之距离（间距）

◆测量值可记录存档及列印

◆提供厚度分布统计图表及X_Bar_R管制表

◆自动计算制程能力指标CP、CPK、CPM

◆可依不同生产线分别作记录

◆可依基板厚度调整焦距

◆可做定时呼叫取样

◆All operations are easy and using Windows interface in Chinese/English version.

◆Survey thickness of tin solder by auto matica lly or manually.

◆Survey the length and width manually,and the gap of tin solder.

◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.

◆All surveyed values can be recorded to a file and be printed to a report.

◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.

◆Calculate man facture ability degree automatically(CP, CPK, CPM)

◆It can have proprietary record according to every different production ling.

◆It can adjust focus point in different thickness of PC boards.

◆It can be called to sample periodically.